S77
Front View
(click to enlarge)
Back View
(click to enlarge)
Issue Details
- Issue Number
- S77
- Issue Type
- S: Solid embroidered patch
- Category
- Regular Issue
- Description
Conclave 2019; Circuit Board design
- Year Issued
- 2019
- Quantity
- 100
- Material
- Embroidery
- Backing Type
- Plastic Back - Security Backing
- Issue Shape
- Flap - Generic
- Border Type
- R
- Border Color
- GLD
- Background Color
- GRN
- Lettering Color
- GLD
- FDL/BSA Color
- YEL
- Manufacturer
- Joycrest
- PatchScan URL
- https://patchscan.com/v1/2ZBCC
- Color Count (PS)
- 9
- Coverage (PS)
- 100
- Size in mm
- Unknown
- Restrictions
- No restrictions on this issue
- Annotations
-
FDL
WWW
Conclave
- Designed by
- No designer listed
- History
- No history entry for this issue
Sets
This issue is not part of any sets
Revision History
There have been 4 revisions. Last change was update on 27 Sep 2026 by Unknown
Is this information incorrect?
File a report and help us improve.
All Catalog Entries
This issue exists in the following catalogs:
-
PatchVault
Nebagamon (312B) S77